Kudelski IoT and PUFsecurity, a specialist in Secure OTP solutions based on PUF technology, announce partnership.

SEMI has published a series of recommendations for the European Union to help bolster its semiconductor ecosystem.

SICK’s new LXRC and LXRH sensors have been designed specifically for continuous level monitoring across many sectors.

KIOXIA Europe has announced that its Universal Flash Storage (UFS) Ver. 4.0 embedded flash memory devices have received ...

AKM begins mass production and shipment of its next-generation InAs (indium arsenide) compound Hall element, the HQ0A11.

Researchers developing camera technology that will bring high resolution to the entire range of infrared imaging.

Monolith has been selected by HORIBA MIRA as its AI partner for data-driven battery and powertrain development.

Marvell's agreement sees collaboration across AWS products and the use of its cloud infrastructure to drive innovation.

Morse Micro releases a fully integrated development platform designed to advance IoT solutions across industries.

Amphenol RF has introduced a new IP67 FAKRA straight crimp rear mount bulkhead plug into its expansive portfolio.

BAE Systems has announced that it will be looking to take on a record number of young people for training in 2025.