A new technical paper titled “Spiking Transformer Hardware Accelerators in 3D Integration” was published by researchers at UC ...
A new technical paper titled “MegaMmap: Blurring the Boundary Between Memory and Storage for Data-Intensive Workloads” was ...
Today’s complex products and systems require simulation of many different physics—the thermal, structural, and electromagnetic forces can tax yesterday’s computing environments.
Why AI inference is happening on the CPU, the different technological approaches for AI inference, and examples of AI ...
Overcoming the many multi-die design challenges and improve productivity with optimized performance and system power.
Enabling Authenticated Encryption Testing in Systems-in-Package” was published by researchers at University of Florida and ...