EDN

Wafer probe cards lower wire-bond logic, SoC test costs

Livermore, Calif.—FormFactor Inc. has developed a family of advanced wafer probe cards designed to address the rising cost and technology challenges associated with testing wire bond logic and ...
Business Wire

Spirent Provides Another Industry-First with 400G Testing and Monitoring Probe

FREDERICK, Md.--(BUSINESS WIRE)--Spirent Communications plc (LSE:SPT), the leading provider of test and assurance solutions for next-generation devices and networks, today announced the availability ...
Embedded

Breaking New Ground in Wire Bond Inspection with Capacitive Test Methods

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...
Electronic Design

Long-Wire ZIF Probe Tip Eases DDR/GDDR Validation

In collaboration with Hynix Semiconductor, the company unveils a high-bandwidth, high-performance long-wire ZIF probe tip optimized for DDR and GDDR SDRAM validation. Groomed for use with the ...
EDN

Two good test probes are all you need

As with most successful technologies over the past few decades, test equipment has improved rapidly to adapt to ever changing requirements. When you look under the hood of a new car, for instance, you ...