Predicted molecular structure of the coordination complex between silver ions and THPP using DFT calculations, along with electrodeposition behavior of silver coatings for different electrolytes. A ...
Fraunhofer ISE development also uses recyclable aluminum for masking – removing need for problem polymers. Thin copper contacts mean the silicon layer does not experience much shading. The rising ...
DuPont de Nemours, Inc. DD recently launched SOLDERON BP TS 7000, the latest innovation in tin-silver plating chemistry, at the IEEE Electronic Components and Technology Conference (ECTC), in Orlando, ...
New phosphorus-based solution enables high-quality plating without toxic materials, simplifying the process for semiconductors and medical devices. From left: Se-il Kim, Senior Researcher at the Korea ...
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