Semiconductor Packaging News
WEBAnswer: October 3, 1995. October 3, 2024. Cerebras' IPO Paperwork Sheds Light on Relationship with G42. Cerebras, a Silicon Valley AI chip startup, has filed for an IPO, intending to list on Nasdaq under CBRS. The filing reveals 2023 revenues of $79 million, with G42 accounting for 87%.
TSMC, Amkor to bring advanced chip packaging to U.S. for first time
WEB2 days ago · TSMC and Amkor have partnered to bring advanced chip packaging to the U.S., marking a milestone in American efforts to boost domestic semiconductor capabilities. This collaboration will support key clients like Nvidia, AMD, and Apple, accelerating U.S. chip production and innovation. The dedicated team at Semiconductor Packaging News has ...
Government Chip Funding Spreads Globally
WEB1 day ago · Government Chip Funding Spreads Globally. Governments worldwide are ramping up investments in their semiconductor industries to bolster national security, address supply chain vulnerabilities, and mitigate geopolitical risks, particularly between the U.S. and China. Initiatives include subsidies, tax breaks, and strategic partnerships, with ...
Semiconductor Packaging News
WEBThe semiconductor industry is crucial for global growth sectors like AI, cloud computing, and defense. In response, the EU and U.S. have enacted "chips acts" to boost domestic production, aiming for semiconductor sovereignty by 2030 amid geopolitical tensions and market challenges. EE Times Europe. Chipzilla back on death row.
Super Micro shares soar after server company says it’s shipping …
WEB1 day ago · Summary Super Micro shares surged 15% after announcing it ships over 100,000 AI-focused GPUs per quarter, potentially generating billions in revenue. The company also unveiled a cost-saving cooling product for data centers, though it remains under DOJ investigation for alleged accounting manipulation.
Biden signs bill cutting environmental reviews for semiconductor …
WEB5 days ago · Summary. President Biden signed a bill exempting semiconductor manufacturing facilities from environmental reviews, speeding up key sectors like clean energy. Despite support for boosting innovation, opponents, including environmental groups, warn of potential hazards from toxic waste, particularly PFAS chemicals linked to health risks. The Hill.
TSMC’s Plan For Closing The Communication Gap
WEB5 days ago · TSMC’s Plan For Closing The Communication Gap. TSMC’s North American OIP Ecosystem Forum showcased its innovation roadmap, with N3E in production and N2 planned for 2025. The event emphasized collaboration and tackled the growing compute-memory communication gap, highlighting advances like TSMC's Compact Universal Photonic Engines (COUPE).
Semiconductor Packaging News Index
WEBSemiconductor Engineering. Oct 4, 2024. SUMMARY. China chip-packaging giant JCET takes over Shanghai plant of US flash memory maker SanDisk. Chinese chip-packaging giant JCET has acquired an 80% stake in SanDisk's Shanghai plant for $624 million, boosting its position in ... South China Morning Post.
Will 2024 be the Year of Advanced Packaging?
WEBWill 2024 be the Year of Advanced Packaging? IDTechEx's report highlights how advanced packaging technologies like 2.5D & 3D are boosting semiconductor innovation. These methods improve chiplet integration & system performance, paving the way for breakthroughs in AI, 5G & data centers despite material & cost challenges.
CHIPS Subsidy Boosts Advanced Packaging in U.S.
WEBA $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech. The dedicated team at Semiconductor Packaging News has provided this …